Gold Electrolyte 4 g/L – Gold Plating Solution Without Free Cyanides
€40.00
Available, delivery time: 1-2 days
Product information "Gold Electrolyte 4 g/L – Gold Plating Solution Without Free Cyanides"
Gold Electrolyte 4 g/L – for Pen Plating, Tampon Plating and Bath Plating
High-quality gold electrolyte containing 4 g/L gold for professional and private applications in pen plating, tampon plating and bath plating.
This ready-to-use gold electrolyte is suitable for the precise and uniform electroplating of a wide range of electrically conductive surfaces. With a concentration of 4 g of gold per liter, the electrolyte is suitable for both fine decorative coatings and the controlled build-up of thicker gold layers.
The gold is present in the electrolyte as a chemically bound cyanide complex. No free cyanides are contained in the electrolyte.
The electrolyte is highly versatile and can be used for precise pen plating, flexible tampon plating, as well as conventional bath plating.
Your Advantages
4 g/L gold content
Ready-to-use gold electrolyte
Suitable for pen plating
Suitable for tampon plating
Suitable for bath plating
Bright gold deposition
Uniform and controllable coating
Suitable for decorative and technical applications
Layer thicknesses up to approx. 4 µm
Gold deposit containing 99.9% gold
Platinum suitable as an electrode
Suitable for professional users, workshops and experienced private users
Technical Data
| Parameter | Value |
|---|---|
| Gold content | 4 g/L |
| pH value | 4.3–4.5 |
| Operating temperature | 18–40 °C |
| Recommended plating factor | 0.008–0.012 A/cm² |
| Standard plating factor | 0.01 A/cm² |
| Deposition rate | approx. 0.15 µm/min at 0.01 A/cm², 20 °C and low agitation |
| Maximum layer thickness | 4 µm |
| Electrode | Platinum |
| Deposit composition | 99.9% gold |
| Remaining component | Carbon |
| Cathode efficiency | approx. 25% |
| Hardness | 190–210 HV |
| Density | 19.3 g/cm³ |
| Internal stress | Medium |
| Cyanide | Bound cyanide complex, no free cyanides |
For Pen Plating
Pen plating allows individual areas, small sections and smaller workpieces to be selectively gold plated.
Ideal for:
Repair plating
Re-plating worn areas
Individual surfaces
Edges and details
Jewelry
Watches and watch components
Electrical contacts
Decorative selective plating
The electrolyte is supplied to the surface through a suitable plating pen or plating head.
Pen plating allows highly precise and controlled processing without having to immerse the entire workpiece in a plating bath.
For Tampon Plating
Tampon plating is particularly suitable for larger surfaces, partial areas and difficult-to-access sections.
The electrolyte is supplied to the surface through a suitable electrolyte-soaked tampon. The plating head is moved evenly across the area to be coated, allowing the gold layer to be built up precisely where required.
Typical applications include:
Large partial surfaces
Repair plating
Re-plating
Jewelry
Decorative components
Technical components
Difficult-to-access surfaces
Several passes can be used to build up a thicker gold layer in a controlled manner.
For Bath Plating
The gold electrolyte can also be used for conventional bath plating.
The workpiece is immersed completely or partially in the gold electrolyte and connected as the cathode. A suitable platinum electrode is used as the anode.
The process is controlled using the plating factor / current density.
Recommended range:
0.008–0.012 A/cm²
Reference value:
0.01 A/cm²
Example for Current Calculation
For a workpiece surface area of 8 cm² and a plating factor of 0.01 A/cm²:
8 cm² × 0.01 A/cm² = 0.08 A
The required current can therefore be calculated directly from the surface area being plated.
Why No Fixed Voltage Is Specified
With this electrolyte, the plating process is controlled using the plating factor / current density.
The actual voltage required can vary depending on the plating equipment, electrode area, electrode distance, workpiece and electrolyte conditions.
For this reason, no general fixed voltage value is specified as a universal operating parameter for this electrolyte.
Deposition Rate
At a plating factor of 0.01 A/cm², a temperature of 20 °C and low agitation, the specified deposition rate is approximately:
0.15 µm of gold per minute
The actual deposition rate may vary depending on temperature, agitation and the individual operating conditions.
The maximum specified layer thickness is 4 µm.
High-Purity Gold Deposit
The specified deposit composition is:
99.9% gold
with a small remaining carbon content.
The gold deposit has a hardness of approximately 190–210 HV and a density of 19.3 g/cm³.
The quality and appearance of the finished gold coating depend significantly on the preparation and surface quality of the workpiece. Electroplating reproduces the existing surface structure, so scratches, pores and polishing marks should be removed before plating if a high-quality finish is required.
Suitable Applications
The 4 g/L gold electrolyte is suitable for a wide range of applications, including:
Jewelry and jewelry components
Rings and pendants
Watches and watch components
Goldsmith work
Repair and restoration
Re-plating
Decorative surfaces
Selective gold plating
Technical components
Electrical contacts
High-quality surface finishing
Pen plating
Tampon plating
Bath plating
Suitable Base Materials and Undercoatings
Depending on the base material, suitable surface preparation and intermediate layers may be required for a durable and high-quality gold coating.
Typical base materials include:
Silver
Copper
Brass
Bronze
Nickel
Nickel-containing alloys
Other electroplatable metals
For demanding base materials, a suitable barrier, strike or intermediate coating may be required.
Bound Cyanide Complex – No Free Cyanides
The gold is present in the electrolyte as a chemically bound cyanide complex.
No free cyanides are contained in the electrolyte.
This gold chemistry provides a stable electrolyte and controlled gold deposition during the electroplating process.
Available for Private and Professional Users
The gold electrolyte is available for private and commercial users.
Suitable for:
Hobby users
Goldsmiths
Watchmakers
Restorers
Workshops
Side businesses
Commercial businesses
Professional plating companies
Industry
Laboratories
High-Quality Gold Electrolyte for Versatile Plating Applications
With 4 g/L gold, this electrolyte provides a versatile solution for electroplating with pen, tampon and bath plating systems.
Whether you need precise repair plating with a plating pen, larger selective areas with tampon plating or conventional bath plating – this electrolyte allows controlled and high-quality gold deposition.
4 g/L gold – 99.9% gold deposit – for pen plating, tampon plating and bath plating.
Pictogram
Signal word Danger
Hazard statement(s)
H302 Harmful if swallowed.
H313 May be harmful in contact with skin.
H317 May cause an allergic skin reaction.
Precautionary statement(s)
P261 Avoid breathing dust/ fume/ gas/ mist/ vapours/spray.
P305 + P351 + P338 IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.
HS Code: 3824 99 70